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• W1878652271 startingPage "2914" @default.
• W1878652271 abstract "The measurement of mechanical properties at the microscale is of interest across a wide range of engineering applications. Much recent work has demonstrated that micropillar compression can be used to measure changes in flow properties at temperatures up to 600°C. In this work, we demonstrate that an alternative microscale bend testing geometry can be used to measure elastic, plastic, and fracture behavior up to 770°C in silicon. We measure a Young’s modulus value of 130 GPa at room temperature, which is seen to drop with increasing temperature to ≈125 GPa. Below 500°C, no failure is seen up to elastic strains of 3%. At 530°C, the microcantilever fractures in a brittle fashion. At temperatures of 600°C and above plastic deformation is seen before brittle fracture. The yield stresses at these temperatures are in good agreement with literature values measured using micropillar compression." @default.
• W1878652271 created "2016-06-24" @default.
• W1878652271 creator A5004632400 @default.
• W1878652271 creator A5034719668 @default.
• W1878652271 date "2015-09-14" @default.
• W1878652271 modified "2023-09-25" @default.
• W1878652271 title "Bend Testing of Silicon Microcantilevers from 21°C to 770°C" @default.
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• W1878652271 doi "https://doi.org/10.1007/s11837-015-1618-y" @default.
• W1878652271 hasPublicationYear "2015" @default.
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