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• W1880781630 abstract "Advances in micro-fabrication techniques combined with accurate simulation tools has provided the means for the realisation of complex terahertz circuitry. Silicon micro-machining provides the way forward to fabricate accurate rugged structures. Multi-level deep reactive ion etching can be used to replace traditional machining methods achieving smaller feature size, improved surface finish and greater freedom in circuit layout. Photonic Bandgap waveguides enable three dimensional arrangements of active devices antennae and filters, and removes the requirement for metallisation of adjoining surfaces. This paper describes some of the state of the art terahertz circuit design and realisation using these techniques." @default.
• W1880781630 created "2016-06-24" @default.
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• W1880781630 date "2003-08-27" @default.
• W1880781630 modified "2023-10-10" @default.
• W1880781630 title "Microfabrication of 3D terahertz circuitry" @default.
• W1880781630 cites W2135477177 @default.
• W1880781630 doi "https://doi.org/10.1109/mwsym.2003.1212477" @default.
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