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• W1888223820 abstract "We combine Electro Optical Terahertz Pulse Refectometry (EOTPR), with full three dimensional device-under-test (DUT) modeling utilizing virtual known good device to quickly and non-destructively isolate faults in advanced 3D IC packages. Computation power required for modeling can quickly become prohibitive with the design complexities of modern IC packages. In this study we adopt a piecemeal modeling approach that bypasses this exponential requirement. A PFA study verifes the accuracy of our model. Tis shows that feature-based fault analysis with a distance-to-defect accuracy of less than 10 μm can be readily attained through the combination of these techniques." @default.
• W1888223820 created "2016-06-24" @default.
• W1888223820 creator A5026080583 @default.
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• W1888223820 date "2015-06-01" @default.
• W1888223820 modified "2023-09-27" @default.
• W1888223820 title "Fast feature based non-destructive fault isolation in 3D IC packages utilizing virtual known good device" @default.
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• W1888223820 doi "https://doi.org/10.1109/ipfa.2015.7224334" @default.
• W1888223820 hasPublicationYear "2015" @default.
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