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- W1900365510 abstract "A simple model of thermal dissociation of hydrogen from silicon dangling bonds (P/sub b/ centers) and their hydrogen passivation with vacuum annealing is suggested. It takes into account the reactions occurring for hydrogen with defect states at the interface of the Si/SiO/sub 2/ structure as well as the diffusion process for atomic and molecular hydrogen. The reaction kinetic coefficients were calculated in diffusion approximation. Excellent agreement of calculations with experimental data was obtained in the temperature range (480-700/spl deg/C), and oxide thickness of (200-1024 /spl Aring/) for the (111) and (100) interfaces." @default.
- W1900365510 created "2016-06-24" @default.
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- W1900365510 date "2002-11-22" @default.
- W1900365510 modified "2023-09-25" @default.
- W1900365510 title "Physical model and numerical results of dissociation kinetics of hydrogen-passivated Si/SiO/sub 2/ interface defects" @default.
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- W1900365510 doi "https://doi.org/10.1109/hkedm.1997.642328" @default.
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