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- W1912325555 abstract "J-E characteristics with annealing effect of Ta₂O_5 films have been studied for the application of high density DRAM devices. Tantalum pentoxide thin films were deposited by PECVD and annealed by various temperatures. The leakage current decreases in O₂ ambients hut increase in N₂ ambients with increasing annealing temperature, which can be explained by the growth of an ₂ layer at the Ta₂O_5-Si interface and the transition from the amorphous flim to the polycrystalline flims. It seems that the conduction mechanism is Poole-Frenkel conduction. We verified that dielectric constant of Ta₂O_5 thin flims annealed at 700~900℃ is less than the as-deposited films(er?25), which is 14~15 in O₂ ambients and 20~23 in N₂ ambients." @default.
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- W1912325555 date "1992-07-01" @default.
- W1912325555 modified "2023-09-27" @default.
- W1912325555 title "Electrical Conduction Characteristics due to Annealing Effect of Ta₂O5 Thin Flim Prepared by PECVD Method" @default.
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