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- W1916213107 abstract "Ball grid array (BGA) techniques have developed very fast due to the advantages of more I/O ports, small size, and so on. In this paper, a vision-based algorithm for BGA package inspection is proposed to accurately estimate center and diameters of solder-balls of BGA packages, so that defects of BGA packages, such as missing or extra balls, oversize or undersize balls, over-height or under-height balls, and pitch can be detected for ensuring the quality of BGA packages." @default.
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- W1916213107 date "2003-06-26" @default.
- W1916213107 modified "2023-09-24" @default.
- W1916213107 title "New approach to vision-based BGA package inspection" @default.
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- W1916213107 doi "https://doi.org/10.1109/icmlc.2002.1174556" @default.
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