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- W1921258204 abstract "Bimodal distributions of time-to-failure (TTF) were often seen in copper via electromigration (EM) tests. The failure mechanism of the stressed samples could be correlated to time-to-failure of the EM test. Early-failures were via-related, whereas late-failures were metal-stripe-related. The failure mechanisms are discussed." @default.
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- W1921258204 date "2002-11-13" @default.
- W1921258204 modified "2023-10-15" @default.
- W1921258204 title "A study of bimodal distributions of time-to-failure of copper via electromigration" @default.
- W1921258204 cites W2005668524 @default.
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- W1921258204 doi "https://doi.org/10.1109/vtsa.2001.934537" @default.
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