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- W1926805433 abstract "Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 /spl mu/m. The set-up and the operation of this tool are described in detail." @default.
- W1926805433 created "2016-06-24" @default.
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- W1926805433 date "1997-01-01" @default.
- W1926805433 modified "2023-09-26" @default.
- W1926805433 title "A versatile pick and place tool for ultraprecise placement-demonstrated by the application in an advanced MCM-D technology" @default.
- W1926805433 doi "https://doi.org/10.1109/iemt.1997.626874" @default.
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