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- W1941824216 abstract "This paper describes a novel method for transfer and assembly of microstructures using sacrificial-layer micromachining and flip-chip bonding. The technique is performed at room temperature (cold weld) and at the back end of the process flow, and may thus provide a commercially viable alternative to monolithic integration and costly hybrid packages. The transfer is achieved using break-away tethers and by cold welding electroplated indium solder bumps to thick electroplated copper pads. Both high aspect ratio MEMS devices as well as surface micromachined devices have been successfully transferred using this method with no observable misalignment between moving and stationary parts. The ultimate tensile and shear strength of the solder bond is measured to be 11/spl plusmn/3 MPa and 9/spl plusmn/1 MPa respectively. The contact resistance is measured to be of the order of 1.5 m/spl Omega/ for a 65 /spl mu/m/spl times/65 /spl mu/m/spl times/4 /spl mu/m indium bump." @default.
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- W1941824216 date "2002-11-22" @default.
- W1941824216 modified "2023-09-26" @default.
- W1941824216 title "Batch transfer of microstructures using flip-chip solder bump bonding" @default.
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- W1941824216 doi "https://doi.org/10.1109/sensor.1997.613634" @default.
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