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• W1948233774 abstract "This paper describes the integration of Copper with a SiOC/AirGap in a 0.18 /spl mu/m Double Level Metal Interconnect. A new concept is presented to achieve this ultimate interconnect scheme, and its feasibility is demonstrated by a 55% reduction of the total capacitance measured versus a Cu/SiO2 interconnect." @default.
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• W1948233774 date "2002-11-07" @default.
• W1948233774 modified "2023-09-24" @default.
• W1948233774 title "Copper-SiOC-AirGap integration in a double level metal interconnect" @default.
• W1948233774 doi "https://doi.org/10.1109/iitc.2000.854347" @default.
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