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• W1956574598 abstract "This study comprise a comparative analysis of the effects of polyethylene glycol (PEG) and other additives used in copper electrodeposition processes over 316 L stainless steel permanent cath- odes. Both cyclic voltammetry and potentiostatic pulse techniques showed analogous results with re- gard to the increase in the use of the real organic ad- ditive and the persistence of a more constant rough- ness level at higher electrodeposition times when PEG baths are used instead of baths containing glue. The mechanism taking place in the presence of PEG corresponds to two-dimensional nucleation together with three-dimensional diffusion grain growth. Fur- thermore, the contribution of the hydrogen evolution reaction (HER) was observed at t > 15 seconds when additives of PEG + thiourea were used, while the same contribution was observed from the beginning of the reaction in the case of solutions without PEG." @default.
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• W1956574598 date "2012-10-01" @default.
• W1956574598 modified "2023-09-27" @default.
• W1956574598 title "Use of polyethylene glycol as organic additive in Copper electrodeposition over stainless steel cathodes" @default.
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