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- W1963529503 abstract "Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single solder joint with varied parameters are briefly discussed. A suitable lead-free solder is used in this study which is Sn-3.5Ag-0.7Cu. Simple Single Factor (SSF) method was used to execute this experimental study. Ansys software was used to simulate and investigate the stress response on a single solder ball joints. The results shows that when the shear height is high the shear stress is reduced." @default.
- W1963529503 created "2016-06-24" @default.
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- W1963529503 date "2013-04-01" @default.
- W1963529503 modified "2023-09-27" @default.
- W1963529503 title "Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder" @default.
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- W1963529503 doi "https://doi.org/10.1109/uksim.2013.130" @default.
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