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- W1963806553 abstract "The development of silicon nitride materials for high-temperature applications requires an understanding of the grain boundary chemistry. Analytical electron microscopy was used to evaluate the chemical composition of the grain boundaries before and after flexural stress rupture testing and various heat treatments for silicon nitride having strontia and yttria sintering aids. At an elevated temperature the grain boundary pockets were found to under go phase separation with the grain boundaries becoming enriched in strontia, and remaining non-crystalline. In this system creep appears to occur by a solution/reprecipitation mechanism. Viscoelastic flow may also be a strong contributor." @default.
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- W1963806553 date "1989-05-01" @default.
- W1963806553 modified "2023-09-23" @default.
- W1963806553 title "Effect of thermal and stress exposure on grain boundaries of silicon nitride" @default.
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- W1963806553 doi "https://doi.org/10.1016/0304-3991(89)90226-x" @default.
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