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- W1966231696 abstract "Recent developments in microwave GaAs technology are yielding devices with higher power capabilities and increased levels of integration. The mechanical and thermal properties of GaAs and other microwave materials play a key role in the design and assembly of microwave power circuits. Thermal management is a critical element of microwave power circuit design. Thermal properties of microwave materials are discussed and compared with standard microelectronic materials. Material selection criteria are described. Assembly and packaging techniques also affect the overall performance of the GaAs power circuit. The high operating frequencies of microwave circuits make ordinary circuit elements, such as wire bonds and printed conductors, reactive. In addition, electrical performance criteria, such as high current or low impedance, create unique assembly demands. The successful development of a GaAs‐based microwave product is dependent on careful attention to the material properties and precise assembly methods. Techniques of automated assembly and processing are discussed, with ah eye towards maintaining high quality and reliability." @default.
- W1966231696 created "2016-06-24" @default.
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- W1966231696 date "1989-03-01" @default.
- W1966231696 modified "2023-09-25" @default.
- W1966231696 title "Assembly and Packaging Considerations for GaAs Microwave Power Devices" @default.
- W1966231696 cites W2127895870 @default.
- W1966231696 doi "https://doi.org/10.1108/eb044387" @default.
- W1966231696 hasPublicationYear "1989" @default.
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