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- W1966350404 abstract "A new metrology method is described which is capable of extracting information about the flatness and performance of the vacuum chuck which holds the wafer in a photolithographic stepper. The method is based on a comparison of the wafer flatness as measured by the stepper and the wafer flatness as measured by a thickness-based flatness metrology system. The flatness datamaps for one wafer are subtracted using ensemble mathematics to yield a stepper chuck signature datamap. Signatures for several wafers are ensemble averaged to test for statistical validity. Stepper and flatness metrology data as well as statistical signatures are presented. Wafer and operational dependencies are discussed. The signature has potential use in the tracking of chuck wear and the feeding forward of flatness information to stepper control systems." @default.
- W1966350404 created "2016-06-24" @default.
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- W1966350404 date "1993-08-04" @default.
- W1966350404 modified "2023-09-26" @default.
- W1966350404 title "Characterization of stepper chuck performance" @default.
- W1966350404 doi "https://doi.org/10.1117/12.148940" @default.
- W1966350404 hasPublicationYear "1993" @default.
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