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- W1967244911 endingPage "025003" @default.
- W1967244911 startingPage "025003" @default.
- W1967244911 abstract "In this paper, Cu–Sn stack bonding technology for 3D-TSV packaging was described; some key technologies such as TSV (through silicon via) formation, silicon wafer thinning, TSV electroplating and Cu–Sn multilayer stack bonding were introduced. First of all, some sample chips with TSV and Cu–Sn bonding pads were fabricated for stacking. Then, two kinds of stack bonding experiments with or without TSV were carried out, respectively. 3-die, 7-die, and 10-die stacks were bonded and assembled. Finally, the bonding strengths of 3D-TSV stacking were characterized by shear test and tensile test, and also the electrical properties, thermal properties and corrosion resistance of stacked module. All the test results suggested that the reliable stack bonding technology can be used for 3D integration applications." @default.
- W1967244911 created "2016-06-24" @default.
- W1967244911 creator A5001916762 @default.
- W1967244911 creator A5004681053 @default.
- W1967244911 creator A5016199719 @default.
- W1967244911 creator A5041881412 @default.
- W1967244911 date "2014-01-06" @default.
- W1967244911 modified "2023-09-26" @default.
- W1967244911 title "A reliable Cu–Sn stack bonding technology for 3D-TSV packaging" @default.
- W1967244911 cites W128612055 @default.
- W1967244911 cites W2001870828 @default.
- W1967244911 cites W2016993958 @default.
- W1967244911 cites W2069822079 @default.
- W1967244911 cites W2083260984 @default.
- W1967244911 cites W2113528547 @default.
- W1967244911 cites W2115446257 @default.
- W1967244911 cites W2128259088 @default.
- W1967244911 doi "https://doi.org/10.1088/0268-1242/29/2/025003" @default.
- W1967244911 hasPublicationYear "2014" @default.
- W1967244911 type Work @default.
- W1967244911 sameAs 1967244911 @default.
- W1967244911 citedByCount "20" @default.
- W1967244911 countsByYear W19672449112014 @default.
- W1967244911 countsByYear W19672449112015 @default.
- W1967244911 countsByYear W19672449112016 @default.
- W1967244911 countsByYear W19672449112017 @default.
- W1967244911 countsByYear W19672449112018 @default.
- W1967244911 countsByYear W19672449112021 @default.
- W1967244911 countsByYear W19672449112022 @default.
- W1967244911 countsByYear W19672449112023 @default.
- W1967244911 crossrefType "journal-article" @default.
- W1967244911 hasAuthorship W1967244911A5001916762 @default.
- W1967244911 hasAuthorship W1967244911A5004681053 @default.
- W1967244911 hasAuthorship W1967244911A5016199719 @default.
- W1967244911 hasAuthorship W1967244911A5041881412 @default.
- W1967244911 hasConcept C111106434 @default.
- W1967244911 hasConcept C159985019 @default.
- W1967244911 hasConcept C160671074 @default.
- W1967244911 hasConcept C171250308 @default.
- W1967244911 hasConcept C178790620 @default.
- W1967244911 hasConcept C185592680 @default.
- W1967244911 hasConcept C192562407 @default.
- W1967244911 hasConcept C199360897 @default.
- W1967244911 hasConcept C201414436 @default.
- W1967244911 hasConcept C2779133538 @default.
- W1967244911 hasConcept C2779227376 @default.
- W1967244911 hasConcept C33347731 @default.
- W1967244911 hasConcept C41008148 @default.
- W1967244911 hasConcept C45632049 @default.
- W1967244911 hasConcept C49040817 @default.
- W1967244911 hasConcept C51807945 @default.
- W1967244911 hasConcept C530198007 @default.
- W1967244911 hasConcept C544956773 @default.
- W1967244911 hasConcept C59088047 @default.
- W1967244911 hasConcept C9395851 @default.
- W1967244911 hasConceptScore W1967244911C111106434 @default.
- W1967244911 hasConceptScore W1967244911C159985019 @default.
- W1967244911 hasConceptScore W1967244911C160671074 @default.
- W1967244911 hasConceptScore W1967244911C171250308 @default.
- W1967244911 hasConceptScore W1967244911C178790620 @default.
- W1967244911 hasConceptScore W1967244911C185592680 @default.
- W1967244911 hasConceptScore W1967244911C192562407 @default.
- W1967244911 hasConceptScore W1967244911C199360897 @default.
- W1967244911 hasConceptScore W1967244911C201414436 @default.
- W1967244911 hasConceptScore W1967244911C2779133538 @default.
- W1967244911 hasConceptScore W1967244911C2779227376 @default.
- W1967244911 hasConceptScore W1967244911C33347731 @default.
- W1967244911 hasConceptScore W1967244911C41008148 @default.
- W1967244911 hasConceptScore W1967244911C45632049 @default.
- W1967244911 hasConceptScore W1967244911C49040817 @default.
- W1967244911 hasConceptScore W1967244911C51807945 @default.
- W1967244911 hasConceptScore W1967244911C530198007 @default.
- W1967244911 hasConceptScore W1967244911C544956773 @default.
- W1967244911 hasConceptScore W1967244911C59088047 @default.
- W1967244911 hasConceptScore W1967244911C9395851 @default.
- W1967244911 hasIssue "2" @default.
- W1967244911 hasLocation W19672449111 @default.
- W1967244911 hasOpenAccess W1967244911 @default.
- W1967244911 hasPrimaryLocation W19672449111 @default.
- W1967244911 hasRelatedWork W2020747132 @default.
- W1967244911 hasRelatedWork W2088052449 @default.
- W1967244911 hasRelatedWork W2100273132 @default.
- W1967244911 hasRelatedWork W2113453347 @default.
- W1967244911 hasRelatedWork W2136056669 @default.
- W1967244911 hasRelatedWork W2352335320 @default.
- W1967244911 hasRelatedWork W3085515726 @default.
- W1967244911 hasRelatedWork W2414897506 @default.
- W1967244911 hasRelatedWork W2466156942 @default.
- W1967244911 hasRelatedWork W3022523847 @default.
- W1967244911 hasVolume "29" @default.
- W1967244911 isParatext "false" @default.
- W1967244911 isRetracted "false" @default.
- W1967244911 magId "1967244911" @default.
- W1967244911 workType "article" @default.