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- W1967805551 abstract "The phenomenon of process damping as a stabilising effect in milling has been encountered by machinists since milling and turning began. It is of great importance when milling aerospace alloys where maximum surface speed is limited by excessive tool wear and high speed stability lobes cannot be attained. Much of the established research into regenerative chatter and chatter avoidance has focussed on stability lobe theory with different analytical and time domain models developed to expand on the theory first developed by Trusty and Tobias. Process damping is a stabilising effect that occurs when the surface speed is low relative to the dominant natural frequency of the system and has been less successfully modelled and understood. Process damping is believed to be influenced by the interference of the relief face of the cutting tool with the waveform traced on the cut surface, with material properties and the relief geometry of the tool believed to be key factors governing performance. This study combines experimental trials with Finite Element (FE) simulation in an attempt to identify and understand the key factors influencing process damping performance in titanium milling. Rake angle, relief angle and chip thickness are the variables considered experimentally with the FE study looking at average radial and tangential forces and surface compressive stress. For the experimental study a technique is developed to identify the critical process damping wavelength as a means of measuring process damping performance. For the range of parameters studied, chip thickness is found to be the dominant factor with maximum stable parameters increased by a factor of 17 in the best case. Within the range studied, relief angle was found to have a lesser effect than expected whilst rake angle had an influence." @default.
- W1967805551 created "2016-06-24" @default.
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- W1967805551 date "2011-12-08" @default.
- W1967805551 modified "2023-09-27" @default.
- W1967805551 title "Process Damping Parameters" @default.
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- W1967805551 doi "https://doi.org/10.1088/1757-899x/26/1/012008" @default.
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