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- W1968488131 abstract "This work investigates the deposition properties of selective chemically vapor-deposited tungsten for filling the deep sub-half micron contact holes using the process of silane reduction of tungsten hexafluoride. Low-resistivity tungsten with excellent selectivity and conformal coverage can be obtained with a SiH4WF6 flow rate ratios less than 0.6 at deposition temperatures between 280 to 350 °C. Junction leakage and contact resistance of the AlSiCu/Wn+P and AlSiCu/W/p + n diodes as well as the electromigration properties of the AlSiCu/Wn+ p structure were investigated." @default.
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- W1968488131 date "1995-12-01" @default.
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- W1968488131 title "Selective tungsten CVD on submicron contact hole" @default.
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- W1968488131 doi "https://doi.org/10.1016/0040-6090(96)80078-2" @default.
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