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• W1968578329 abstract "Abstract An eigenfuntion expansion method is employed for obtaining three-dimensional asymptotic displacement and stress fields in the vicinity of the front of a crack/anticrack discontinuity weakening/reinforcing an infinite pie-shaped trimaterial plate, of finite thickness, formed as a result of bimaterial (matrix/ARC plus reaction product/scatterer) deposit over a substrate (fiber/semiconductor). The wedge is subjected to mode I/II far field loading. Each material is isotropic and elastic, but with different material properties. The material 2 or the substrate is always taken to be a half-space, while the wedge aperture angle of the material 1 is varied to represent varying composition of the bimaterial deposit. Numerical results pertaining to the variation of the mode I/II eigenvalues (or stress singularities) with Young’s moduli ratio, as well as with the wedge aperture angle of the material 1 (reaction product/scatterer) are presented. Hitherto generally unavailable results, pertaining to the through-thickness variations of stress intensity factors or stress singularity coefficients for symmetric exponentially growing distributed load and its skew-symmetric counterpart that also satisfy the boundary conditions on the top and bottom surfaces of the trimaterial plates under investigation, bridge a longstanding gap in the stress singularity/interfacial fracture mechanics literature." @default.
• W1968578329 created "2016-06-24" @default.
• W1968578329 creator A5040419557 @default.
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• W1968578329 date "2012-01-01" @default.
• W1968578329 modified "2023-10-17" @default.
• W1968578329 title "Three-dimensional asymptotic mode I/II stress fields at the front of interfacial crack/anticrack discontinuities in trimaterial bonded plates" @default.
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• W1968578329 doi "https://doi.org/10.1016/j.compstruct.2011.07.017" @default.
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