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- W1969088507 abstract "Silicone-modified phenolic resin was prepared by synthesizing phenol, formaldehyde and phenyltrimethoxysilane, which were supported by Fourier Transform Infrared Spectoscopy (FT-IR). The carbon residual rate of Silicone-modified phenolic resin increased steeply when the silicone modifier was added increasing from 5% to 15%(on resin base) which was tested in an air atmosphere,from room temperature to 800 °C by Thermogravimetric Analysis (TG) ,modified resin of 15% silicone modifier had the highest carbon residue rate. Curing process of silicone-modified phenolic resin determined by Differential Scanning Calorimetry (DSC) was: 80°C/4h+100°C/2h+120°C/2h+160°C/3h+180°C/2h. Curing Kinetic Study on silicone-modified phenolic resin was made to understand the curing process better." @default.
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- W1969088507 date "2015-01-01" @default.
- W1969088507 modified "2023-10-18" @default.
- W1969088507 title "Preparation and Curing Behavior of Silicone-Modified Phenolic Resin" @default.
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- W1969088507 doi "https://doi.org/10.4028/www.scientific.net/amm.713-715.2798" @default.
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