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• W1969194617 abstract "We present an analytical model of transient compressive stress evolution during growth of thin films with high surface and grain boundary diffusivities on substrates. The model provides a closed-form analytical solution which compares well with numerical analysis as well as recent experimental data on transient stress evolution during electrodeposition of Sn films on substrates." @default.
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• W1969194617 date "2010-07-28" @default.
• W1969194617 modified "2023-09-23" @default.
• W1969194617 title "Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates" @default.
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• W1969194617 doi "https://doi.org/10.1080/14786431003773007" @default.
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