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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1970303050> ?p ?o ?g. }

• W1970303050 abstract "This paper reports on the development of a measurement system to detect mechanical stress caused by packaging processes. A piezoresistive silicon test chip is used to convert the inducted mechanical stress into a resistance change, measured by a developed resistance analyser. The sensor interface is capable to measure a high number of resistors with a high measurement rate. Thus, also rapid proceeding packaging processes can be characterized. Furthermore, the developed software calculates the stress distribution along the whole die, which includes a compensation of the systematic errors e.g. the temperature dependence of the piezoresistive coefficients." @default.
• W1970303050 created "2016-06-24" @default.
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• W1970303050 date "2010-09-01" @default.
• W1970303050 modified "2023-09-26" @default.
• W1970303050 title "Development of a mechanical stress-analysing-tool to characterize packaging processes" @default.
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• W1970303050 doi "https://doi.org/10.1109/estc.2010.5642854" @default.
• W1970303050 hasPublicationYear "2010" @default.
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