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- W1970889666 abstract "The local distortion of the junction temperature due to large contiguous voids in the die attach of real power devices is investigated and modeled. Temperature fields obtained by thermal simulations are calibrated with experimental data obtained by high-resolution infrared thermography. The junction temperature distortion caused by a large single void is shown to be proportional to the void area via a package-dependent coefficient (differential specific thermal resistance). Further, correction factors which take into account the effects of both aspect ratio and location of the void have been computed, thereby leading to a procedure for an accurate estimation of the local junction temperature distortion peaks." @default.
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- W1970889666 date "1999-11-01" @default.
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- W1970889666 title "Modelling thermal effects of large contiguous voids in solder joints" @default.
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- W1970889666 doi "https://doi.org/10.1016/s0026-2692(99)00073-7" @default.
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