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• W1971286362 startingPage "5353" @default.
• W1971286362 abstract "Heterogeneous III&#x2013;V/Si integration with a compact optical vertical interconnect access is fabricated and the light coupling efficiency between the III&#x2013;V/Si waveguide and the silicon nanophotonic waveguide is characterized. The III&#x2013;V semiconductor material is directly bonded to the silicon-on-insulator (SOI) substrate and etched to form the III&#x2013;V/Si waveguide for a higher light confinement in the active region. The compact optical vertical interconnect access is formed through tapering a III&#x2013;V and an SOI layer in the same direction. The measured III&#x2013;V/Si waveguide has a light coupling efficiency above &#x223C;90% to the silicon photonic layer with the tapering structure. This heterogeneous and light coupling structure can provide an efficient platform for photonic systems on chip, including passive and active devices." @default.
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• W1971286362 date "2013-12-09" @default.
• W1971286362 modified "2023-10-02" @default.
• W1971286362 title "Demonstration of heterogeneous III–V/Si integration with a compact optical vertical interconnect access" @default.
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• W1971286362 doi "https://doi.org/10.1364/ol.38.005353" @default.
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