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- W1971623243 abstract "This work presents experimental results on surge current capability of SiC Schottky diodes performed on free floating press-pack encapsulation technologies. For the tests, we used a home-made workbench. The aim of our studies is to improve the current robustness and power density of Silicon Carbide (SiC) devices able to operate at temperatures over 300C°. Various technological approaches have to be considered, mainly on the interconnection technique and metallization layers in order to improve the power density and temperature operation of the diodes. Our investigation showed a strong improvement of electro-thermal performances, and especially the surge current capability that is almost doubled by using press-pack encapsulation." @default.
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- W1971623243 date "2013-01-01" @default.
- W1971623243 modified "2023-10-17" @default.
- W1971623243 title "Remarkable Increase in Surge Current Capability of SiC Schottky Diodes Using Press Pack Contacts" @default.
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- W1971623243 doi "https://doi.org/10.4028/www.scientific.net/msf.740-742.873" @default.
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