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• W1971705391 abstract "An excimer laser exposure system has been newly developed, which adopts a 0.37 NA achromatic projection lens and a 248 nm wavelength KrF excimer laser as a light source. Irregular PMMA development was observed for exposures on a silicon substrate. Theoretical simulation clarified that an initial 0.02 µm thickness variation caused more than 0.16 µm thick resist residues due to intense standing waves. The standing waves could be suppressed by the use of a tri-level resist process so that VLSI patterns of 0.35 µm minimum space could be obtained." @default.
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• W1971705391 date "1988-02-01" @default.
• W1971705391 modified "2023-09-23" @default.
• W1971705391 title "KrF Excimer Laser Projection Lithography: 0.35µm Minimum Space VLSI Pattern Fabrication by a Tri-Level Resist Process" @default.
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• W1971705391 doi "https://doi.org/10.1143/jjap.27.323" @default.
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