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• W1972029339 abstract "The further miniaturization of electronic packages is driven by a large variety of applications with high requirements on pitch and form factor. This will be conducive to higher I/O-counts and a reduction of the solder bump size." @default.
• W1972029339 created "2016-06-24" @default.
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• W1972029339 date "2010-09-01" @default.
• W1972029339 modified "2023-09-26" @default.
• W1972029339 title "Adapted assembly processes for flip-chip technology with solder bumps of 50 &#x00B5;m or 40 &#x00B5;m diameter" @default.
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• W1972029339 doi "https://doi.org/10.1109/estc.2010.5643014" @default.
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