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- W1972211606 abstract "This work proposed a novel design of an intelligent equipment engineering system (IEES) using in the semiconductor and optoelectronics industries. Most present equipment engineering systems (EES) acquire engineering data from equipment to remote servers. In this work, the IEES possesses an embedded data collection system (EDCS) and embeds the EDCS in the equipment for data collection, analysis, and monitor. The framework design of this IEES can reduce huge data transmission in the Internet and resolve factory network burden by handling the large number of equipment data in the EDCS. The EDCS plays a role of equipment data collection and analysis in the semiconductor and optoelectronics and transmits analysis results or alert messages to remote application servers or personal digital assistant. With the IEES, the developers of application can focus on the design and disregard the communication issues. They can communicate with EDCS easily through three standard interfaces and replace the communication modules, application modules, and equipment drivers according to the requirements. In this work, two EES applications are as examples to illustrate the integrated flows between IEES and applications." @default.
- W1972211606 created "2016-06-24" @default.
- W1972211606 creator A5053331595 @default.
- W1972211606 date "2010-06-01" @default.
- W1972211606 modified "2023-09-27" @default.
- W1972211606 title "Design of an intelligent equipment engineering system using in the semiconductor and optoelectronics industries" @default.
- W1972211606 cites W2162251039 @default.
- W1972211606 doi "https://doi.org/10.1109/iciea.2010.5514864" @default.
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