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- W1972552514 abstract "The aim of this study is to optimize the bond process for Cu/Sn wafer-level bonding, a competitive material for modern MEMS encapsulation due to its low cost and high performance. For this Solid-Liquid Interdiffusion (SLID) bonding technique, it is important to understand the formation of the intermetallic compounds (IMCs), which takes place during the bond process. In order to estimate thermodynamic kinetics coefficients, electroplated Cu/Sn multilayer stacks were annealed at temperatures in the range 150–300°C for 0–320 min. The formation process of intermetallic compounds (IMC) were investigated by cross-section microscopy of annealed samples at different time and temperature. The kinetics constants of Cu 3 Sn growth, as well as decreasing Sn thickness, are derived from measured IMC thicknesses. Based upon these extracted kinetics constants, a simulation model for IMC growth and remaining Sn thickness profile during wafer bonding process has been implemented by MATLAB. This model is used to predict an optimized wafer-level Cu/Sn bonding process." @default.
- W1972552514 created "2016-06-24" @default.
- W1972552514 creator A5027771430 @default.
- W1972552514 creator A5056757362 @default.
- W1972552514 creator A5057176376 @default.
- W1972552514 creator A5064106748 @default.
- W1972552514 creator A5083925047 @default.
- W1972552514 date "2012-09-01" @default.
- W1972552514 modified "2023-10-16" @default.
- W1972552514 title "Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization" @default.
- W1972552514 cites W1560276347 @default.
- W1972552514 cites W2026940193 @default.
- W1972552514 cites W2027708390 @default.
- W1972552514 cites W2028655973 @default.
- W1972552514 cites W2029914168 @default.
- W1972552514 cites W2042951272 @default.
- W1972552514 cites W2043639063 @default.
- W1972552514 cites W2060148738 @default.
- W1972552514 cites W2062361834 @default.
- W1972552514 cites W2084373860 @default.
- W1972552514 cites W2113528547 @default.
- W1972552514 cites W2327682491 @default.
- W1972552514 doi "https://doi.org/10.1109/estc.2012.6542151" @default.
- W1972552514 hasPublicationYear "2012" @default.
- W1972552514 type Work @default.
- W1972552514 sameAs 1972552514 @default.
- W1972552514 citedByCount "4" @default.
- W1972552514 countsByYear W19725525142013 @default.
- W1972552514 countsByYear W19725525142014 @default.
- W1972552514 countsByYear W19725525142016 @default.
- W1972552514 countsByYear W19725525142022 @default.
- W1972552514 crossrefType "proceedings-article" @default.
- W1972552514 hasAuthorship W1972552514A5027771430 @default.
- W1972552514 hasAuthorship W1972552514A5056757362 @default.
- W1972552514 hasAuthorship W1972552514A5057176376 @default.
- W1972552514 hasAuthorship W1972552514A5064106748 @default.
- W1972552514 hasAuthorship W1972552514A5083925047 @default.
- W1972552514 hasConcept C160671074 @default.
- W1972552514 hasConcept C171250308 @default.
- W1972552514 hasConcept C191897082 @default.
- W1972552514 hasConcept C192562407 @default.
- W1972552514 hasConcept C27501479 @default.
- W1972552514 hasConcept C2779133538 @default.
- W1972552514 hasConcept C2780026712 @default.
- W1972552514 hasConcept C2780841128 @default.
- W1972552514 hasConcept C49040817 @default.
- W1972552514 hasConceptScore W1972552514C160671074 @default.
- W1972552514 hasConceptScore W1972552514C171250308 @default.
- W1972552514 hasConceptScore W1972552514C191897082 @default.
- W1972552514 hasConceptScore W1972552514C192562407 @default.
- W1972552514 hasConceptScore W1972552514C27501479 @default.
- W1972552514 hasConceptScore W1972552514C2779133538 @default.
- W1972552514 hasConceptScore W1972552514C2780026712 @default.
- W1972552514 hasConceptScore W1972552514C2780841128 @default.
- W1972552514 hasConceptScore W1972552514C49040817 @default.
- W1972552514 hasLocation W19725525141 @default.
- W1972552514 hasOpenAccess W1972552514 @default.
- W1972552514 hasPrimaryLocation W19725525141 @default.
- W1972552514 hasRelatedWork W1985906607 @default.
- W1972552514 hasRelatedWork W1998986614 @default.
- W1972552514 hasRelatedWork W2037256285 @default.
- W1972552514 hasRelatedWork W2075616172 @default.
- W1972552514 hasRelatedWork W2083225653 @default.
- W1972552514 hasRelatedWork W2094570400 @default.
- W1972552514 hasRelatedWork W2228572463 @default.
- W1972552514 hasRelatedWork W2541813973 @default.
- W1972552514 hasRelatedWork W2924636475 @default.
- W1972552514 hasRelatedWork W4254185665 @default.
- W1972552514 isParatext "false" @default.
- W1972552514 isRetracted "false" @default.
- W1972552514 magId "1972552514" @default.
- W1972552514 workType "article" @default.