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• W1972746794 abstract "In this letter, an evolution of high-density (>; 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sup> cm-2) bonded Cu-Cu interconnects of 6-μm pitch is successfully demonstrated using wafer-on-wafer thermocompression bonding. Cu sealing frame with excellent hermeticity is integrated to the bonded structures to promote bond reliability. Additionally, temporary passivation of Cu surface using self-assembled monolayer enhances the resistance against oxidation, which, in turn, enables moderately low-temperature bonding process at 300°C. Finally, thermal cycling test confirms the thermal stability of the 6-μm-pitch Cu-Cu daisy chain structure up to 1000 cycles. This work opens up new opportunity for wafer-level integration of bumpless Cu-Cu bonding to enable future high-bandwidth 3-D integrated circuit applications." @default.
• W1972746794 created "2016-06-24" @default.
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• W1972746794 date "2012-12-01" @default.
• W1972746794 modified "2023-09-28" @default.
• W1972746794 title "Ultrafine Pitch (6 $muhbox{m}$) of Recessed and Bonded Cu–Cu Interconnects by Three-Dimensional Wafer Stacking" @default.
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• W1972746794 doi "https://doi.org/10.1109/led.2012.2218273" @default.
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