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• W1973015909 abstract "Large area silicon or glass interposers may exceed the maximum imaging field of step and repeat lithography tools. This paper discusses the lithographic process used to create a large area interposer on a stepper by the combination of multiple subfield exposures. Overlay metrology structures are used to confirm the relative placement of the subfields to construct the interposer. Routing lines from 1.5 to 4.0 μm in width are evaluated to measure critical dimension (CD) control where the lines cross the subfield boundaries. CD metrology at the bottom and top of the photoresist is performed using a top down CD-SEM. Finally large area test interposers are patterned using two subfields on a 1X stepper and processed through a Cu electroplating module for detailed characterization. The CD control of routing lines as they cross the subfield boundary can be optimized by using a shaped or tapered line end design. Lithography simulation using Prolith modeling software by KLA-Tencor is matched to experimental results and then used to evaluate performance of various line end designs. Larger latitude for overlap error was observed for the tapered line end compared to the standard square line end. The experimental and modeled results in this study show the capability of using stepper lithography to produce large area interposers with 1.5 μm I/O routing line dimensions." @default.
• W1973015909 created "2016-06-24" @default.
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• W1973015909 date "2014-05-01" @default.
• W1973015909 modified "2023-10-03" @default.
• W1973015909 title "Large area interposer lithography" @default.
• W1973015909 cites W1565775189 @default.
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• W1973015909 doi "https://doi.org/10.1109/ectc.2014.6897262" @default.
• W1973015909 hasPublicationYear "2014" @default.
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