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- W1973095092 abstract "A comparative study between pure Pd and Pd(P) films on the solderability was performed. In the Sn–3Ag–0.5Cu/Au/Pd/Ni(P) system (pure Pd case), (Cu,Ni)6Sn5 and Ni3P were the predominant intermetallic species at the interface after the removal of the Au/Pd dual layer in soldering. We found that a significant growth of (Ni,Cu)3Sn4 occurred between (Cu,Ni)6Sn5 and Ni3P after aging at 180 °C for 500 h. This phenomenon was not observed in the reference case, in which a Pd(P) film had replaced the pure Pd layer before the reaction. The (Cu,Ni)6Sn5/(Ni,Cu)3Sn4 interface provided a crack initiation site, seriously deteriorating the high-speed ball shear resistance of the solder joints. The retarded growth of (Ni,Cu)3Sn4 in the Pd(P) case was attributed to the presence of an additional Ni2SnP nanolayer between (Cu,Ni)6Sn5 and Ni3P that prevented the outward diffusion of Ni, thereby inhibiting the formation of the undesired (Cu,Ni)6Sn5/(Ni,Cu)3Sn4 structure. The results of this study indicate Pd(P) film is more beneficial to the solderability than pure Pd." @default.
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- W1973095092 date "2013-10-01" @default.
- W1973095092 modified "2023-10-16" @default.
- W1973095092 title "Sn–Ag–Cu solder reaction with Au/Pd/Ni(P) and Au/Pd(P)/Ni(P) platings" @default.
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- W1973095092 doi "https://doi.org/10.1016/j.tsf.2012.12.070" @default.
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