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• W1973201930 abstract "The tensile strength of electrodeposits generally decreases with increasing bath temperature because the grain size increases and the dislocation density decreases with increasing bath temperature. Therefore, discontinuities observed in the tensile strength vs. bath temperature curves in electrodeposition of copper are unusual. The tensile strength of electrodeposits generally increases with increasing cathode current density because the rate of nucleation in electrodeposits increases with increasing current density, which in turn gives rise to a decrease in the grain size and in turn an increase in the strength. Therefore, a decrease in the tensile strength of copper electrodeposits at a high current density is unusual. The grain size of vapor deposits is expected to decrease with decreasing substrate temperature. However, rf sputtered Co-Cr deposits showed that deposits formed on water-cooled polyimide substrates had a larger grain size than deposits formed on polyimide substrates at 200 °C. These unusual phenomena can be explained by the preferred growth model for deposition texture evolution." @default.
• W1973201930 created "2016-06-24" @default.
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• W1973201930 date "2015-04-24" @default.
• W1973201930 modified "2023-09-23" @default.
• W1973201930 title "Texture related unusual phenomena in electrodeposition and vapor deposition" @default.
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• W1973201930 doi "https://doi.org/10.1088/1757-899x/82/1/012082" @default.
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