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- W1973351418 abstract "This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer." @default.
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- W1973351418 date "2012-10-01" @default.
- W1973351418 modified "2023-10-05" @default.
- W1973351418 title "Wafer-level TSV connectivity test using ring oscillator scheme" @default.
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- W1973351418 doi "https://doi.org/10.1109/epeps.2012.6457883" @default.
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