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- W1973706095 abstract "Vacuum packaging of high performance infrared (IR) MEMS uncooled detectors and arrays, inertial MEMS accelerometers and gyros, and radio frequency (rf) MEMS resonators is a key issue in the technology development path to low cost, high volume MEMS production. Wafer-level vacuum packaging transfers the packaging operation into the wafer fab. It is a product neutral enabling technology for commercialization of MEMS for home, industry, automotive, and environmental monitoring applications. 4 in. wafer-level vacuum packaging has been demonstrated using IR MEMS bolometers and results will be presented in this article. In addition to the wafer-level packaging results, vacuum package reliability results obtained on component-level ceramic vacuum packages will also be presented." @default.
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- W1973706095 date "1999-07-01" @default.
- W1973706095 modified "2023-09-23" @default.
- W1973706095 title "Wafer-level vacuum packaging for MEMS" @default.
- W1973706095 doi "https://doi.org/10.1116/1.581763" @default.
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