FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W1974529085> ?p ?o ?g. }

• W1974529085 abstract "This paper reports an easy, low cost, and low temperature hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. We investigate the bonding results of silicon-silicon as well as silicon-glass and glass-glass bonding. Most hermetic packaging technologies require a bonding temperature higher than 300°C. Because some devices are sensitive to temperature that decreases their functionalities, two localized heating technology have been proposed. One technology generates heat via built-in-microheaters on the silicon substrate. Another localized heating technology utilizes microwave as a heating source [1]. However, both technologies require high cost and cannot be implemented for mass production. Furthermore, local heating creates a large temperature gradient. The stress causes crack on the substrates, thus limiting the selection of substrate materials. We choose eutectic tin-lead with the melting temperature of 183°C. Metal thin films we choose is also similar to the under bump metallurgy used for flip chip technology. The advantage of solder is its metal property. With a width of a few micrometers, metal can block moisture for over a decade. In addition, solder is known to pertain self-aligning property in flip chip technology. Other kind of solders can also be applied for hermetic packaging as well. Shie et al have tested In-Sn as bonding using the reflow temperature as low as 120 °C [2]. Seong-A Kim et. al have tested Au-Sn solder line at 400°C [3,4]. Due to the difference in melting points, the application of Sn-Pb, Au-Sn and In-Sn can be different. Bonding characteristic of our design is investigated on three different setups: silicon-silicon, silicon-glass, and glass-glass samples. (Fig.1) This experiment consists of three different setups: silicon-to-silicon bonding, silicon-to-glass bonding, and glass-to-glass bonding. These three different setups utilize the same bonding method. The design includes square patterns and circle patterns of 500 μm width as shown in Figure 2. Schematic process flow of sample fabrication is demonstrated in Figure 3. Substrate and cap have identical size with the pattern of square of 1 cm in width or circle of 1 cm in diameter. The bonding pad is composed of three layers of metal from bottom to top: 500 Å of chromium, 2000 Å of nickel and 6000 Å of copper.(Fig.3b) Eutectic SnPb solder is reflowed on square or circle patterns on a hot plate at room ambient.(Fig.3d) Sample pairs are then bonded on a hot plate at 200°C for about 1.5 minutes for silicon-silicon and silicon glass bonding and 3 minutes for glass-glass bonding.(Fig.3e) Before placing the sample pairs on the hot plate, for glass-glass and glass-silicon bonding, we align a pair of chips of matched pattern by visual alignment. For silicon-silicon bonding, we align two chips along the dividing lines. Figure 4a and 4b show a glass and a silicon sample after solder reflow respectively. Sample pairs after bonding process are seen in Figure 5a through 5c. Figures 6a through 6c show the cross-sectional picture of the joint. Figures 6b and 6c are enlarged pictures of left and right side of the joints respectively. The average misalignment is 11.2 μm and 13.6 μm for square and circle samples respectively. Bonding strength of the three setups ranges from 3 MPa to 10 MPa. For leakage rate test, a 3 mm hole in diameter was drilled under the sealed area on the substrate side, followed by connecting a glass pipe to the hole by frit glass. The setup can be pumped down to the order of 10−8 torr." @default.
• W1974529085 created "2016-06-24" @default.
• W1974529085 creator A5038329313 @default.
• W1974529085 creator A5039650381 @default.
• W1974529085 creator A5090999943 @default.
• W1974529085 date "2004-01-01" @default.
• W1974529085 modified "2023-09-27" @default.
• W1974529085 title "Self-Aligned Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallization Layer" @default.
• W1974529085 doi "https://doi.org/10.1115/imece2004-61026" @default.
• W1974529085 hasPublicationYear "2004" @default.
• W1974529085 type Work @default.
• W1974529085 sameAs 1974529085 @default.
• W1974529085 citedByCount "0" @default.
• W1974529085 crossrefType "proceedings-article" @default.
• W1974529085 hasAuthorship W1974529085A5038329313 @default.
• W1974529085 hasAuthorship W1974529085A5039650381 @default.
• W1974529085 hasAuthorship W1974529085A5090999943 @default.
• W1974529085 hasConcept C111368507 @default.
• W1974529085 hasConcept C121332964 @default.
• W1974529085 hasConcept C127313418 @default.
• W1974529085 hasConcept C153294291 @default.
• W1974529085 hasConcept C159985019 @default.
• W1974529085 hasConcept C177564732 @default.
• W1974529085 hasConcept C18168003 @default.
• W1974529085 hasConcept C191897082 @default.
• W1974529085 hasConcept C192562407 @default.
• W1974529085 hasConcept C201414436 @default.
• W1974529085 hasConcept C204530211 @default.
• W1974529085 hasConcept C2777289219 @default.
• W1974529085 hasConcept C2779227376 @default.
• W1974529085 hasConcept C37487178 @default.
• W1974529085 hasConcept C50296614 @default.
• W1974529085 hasConcept C525849907 @default.
• W1974529085 hasConcept C544956773 @default.
• W1974529085 hasConcept C68928338 @default.
• W1974529085 hasConcept C79072407 @default.
• W1974529085 hasConcept C87976508 @default.
• W1974529085 hasConceptScore W1974529085C111368507 @default.
• W1974529085 hasConceptScore W1974529085C121332964 @default.
• W1974529085 hasConceptScore W1974529085C127313418 @default.
• W1974529085 hasConceptScore W1974529085C153294291 @default.
• W1974529085 hasConceptScore W1974529085C159985019 @default.
• W1974529085 hasConceptScore W1974529085C177564732 @default.
• W1974529085 hasConceptScore W1974529085C18168003 @default.
• W1974529085 hasConceptScore W1974529085C191897082 @default.
• W1974529085 hasConceptScore W1974529085C192562407 @default.
• W1974529085 hasConceptScore W1974529085C201414436 @default.
• W1974529085 hasConceptScore W1974529085C204530211 @default.
• W1974529085 hasConceptScore W1974529085C2777289219 @default.
• W1974529085 hasConceptScore W1974529085C2779227376 @default.
• W1974529085 hasConceptScore W1974529085C37487178 @default.
• W1974529085 hasConceptScore W1974529085C50296614 @default.
• W1974529085 hasConceptScore W1974529085C525849907 @default.
• W1974529085 hasConceptScore W1974529085C544956773 @default.
• W1974529085 hasConceptScore W1974529085C68928338 @default.
• W1974529085 hasConceptScore W1974529085C79072407 @default.
• W1974529085 hasConceptScore W1974529085C87976508 @default.
• W1974529085 hasLocation W19745290851 @default.
• W1974529085 hasOpenAccess W1974529085 @default.
• W1974529085 hasPrimaryLocation W19745290851 @default.
• W1974529085 hasRelatedWork W117758772 @default.
• W1974529085 hasRelatedWork W1974529085 @default.
• W1974529085 hasRelatedWork W1977548928 @default.
• W1974529085 hasRelatedWork W2001804166 @default.
• W1974529085 hasRelatedWork W2002014073 @default.
• W1974529085 hasRelatedWork W2015902261 @default.
• W1974529085 hasRelatedWork W2140316755 @default.
• W1974529085 hasRelatedWork W2169930846 @default.
• W1974529085 hasRelatedWork W2312508032 @default.
• W1974529085 hasRelatedWork W2542389266 @default.
• W1974529085 isParatext "false" @default.
• W1974529085 isRetracted "false" @default.
• W1974529085 magId "1974529085" @default.
• W1974529085 workType "article" @default.