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- W1974876551 abstract "The use of hard X-ray energies for ultra-deep X-ray lithography requires a thorough re-investigation of all issues associated with the LIGA technology materials issues and processes, in particular for the manufacture of high-energy-X- ray masks. Calculations were performed to compare various mask blanks in particular thick Kapton<SUP>R</SUP> and thinned silicon blanks. Absorber pattern formation schemes have been investigated using UV contact printing or X-ray lithography with SU8 photoresist. SU8 photoresist also offers an improved X-ray sensitivity over PMMA resist. Resist patterns over 500 micron deep with aspect ratio over 10 and vertical sidewalls were achieved in SU-8, allowing the use of medium energy range X-rays to obtain high quality patterns of much greater resist thickness." @default.
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- W1974876551 date "1998-09-01" @default.
- W1974876551 modified "2023-09-23" @default.
- W1974876551 title "Mask prototyping for ultradeep x-ray lithography: preliminary studies for mask blanks and high-aspect-ratio absorber patterns" @default.
- W1974876551 doi "https://doi.org/10.1117/12.324070" @default.
- W1974876551 hasPublicationYear "1998" @default.
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