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• W1976383509 endingPage "100" @default.
• W1976383509 startingPage "96" @default.
• W1976383509 abstract "Molecular dynamics computer simulations were employed to investigate the dynamic processes of diffusion, grain growth, sintering, and consolidation in nanocrystalline copper (n-Cu). At room temperature, fully dense n-Cu was found to be stable. At 1100 K, a large fraction of atoms in the n-Cu became amorphous which provides a new mechanism of grain growth and recrystallization. Atomic mobility in dense n-Cu decreased with time as the grain boundaries relaxed. The initial configurations of the grains were shown to have a strong influence on pressureless sintering. Both hydrostatic pressure and uniaxial stress loading accelerated the process of densification on porous n-Cu. The latter, however, was found more efficient due to grain boundary sliding." @default.
• W1976383509 created "2016-06-24" @default.
• W1976383509 creator A5002422184 @default.
• W1976383509 creator A5078538512 @default.
• W1976383509 date "1995-12-01" @default.
• W1976383509 modified "2023-10-02" @default.
• W1976383509 title "Molecular dynamics simulations of densification processes in nanocrystalline materials" @default.
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• W1976383509 doi "https://doi.org/10.1016/0921-5093(95)09944-1" @default.
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