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• W1977588922 abstract "For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable." @default.
• W1977588922 created "2016-06-24" @default.
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• W1977588922 date "2014-06-01" @default.
• W1977588922 modified "2023-10-18" @default.
• W1977588922 title "Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life" @default.
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• W1977588922 doi "https://doi.org/10.4218/etrij.14.0113.0570" @default.
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