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• W1978017107 startingPage "2061" @default.
• W1978017107 abstract "Rectangular trench profiles are modeled with analytic etch rates determined from measured ion distribution functions. The pattern transfer step for this plasma etch is for trilayer lithography. Argon and chlorine angular ion energy distribution functions measured by a spherical collector ring analyzer are fit to a sum of drifting Maxwellian velocity distribution functions with anisotropic temperatures. The fit of the model ion distribution functions by a simulated annealing optimization procedure converges adequately for only two drifting Maxwellians. The etch rates are proportional to analytic expressions for the ion energy flux. Numerical computation of the etch profiles by integration of the characteristic equations for profile points and connection of the profiles points is efficient." @default.
• W1978017107 created "2016-06-24" @default.
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• W1978017107 date "1999-09-01" @default.
• W1978017107 modified "2023-09-23" @default.
• W1978017107 title "Model etch profiles for ion energy distribution functions in an inductively coupled plasma reactor" @default.
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• W1978017107 doi "https://doi.org/10.1116/1.590873" @default.
• W1978017107 hasPublicationYear "1999" @default.
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