FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W1978103498> ?p ?o ?g. }

• W1978103498 endingPage "1881" @default.
• W1978103498 startingPage "1875" @default.
• W1978103498 abstract "A flip chip package was assembled by using 6-layer laminated polyimide coreless substrate, eutectic Sn37Pb solder bump, two kinds of underfill materials and Sn3.0Ag0.5Cu solder balls. Regarding to the yield, the peripheral solder joints were often found not to connect with the substrate due to the warpage at high temperature, modification of reflow profile was benefit to improve this issue. All the samples passed the moisture sensitive level test with a peak temperature of 260 °C and no delamination at the interface of underfill and substrate was found. In order to know the reliability of coreless flip chip package, five test items including temperature cycle test (TCT), thermal shock test (TST), highly accelerated stress test (HAST), high temperature storage test (HTST) and thermal humidity storage test (THST) were done. Both of the two underfill materials could make the samples pass the HTST and THST, however, in the case of TCT, TST and HAST, the reliability of coreless flip chip package was dominated by underfill material. A higher Young’s modules of underfill, the more die crack failures were found. Choosing a correct underfill material was the key factor for volume production of coreless flip chip package." @default.
• W1978103498 created "2016-06-24" @default.
• W1978103498 creator A5008021980 @default.
• W1978103498 creator A5010796482 @default.
• W1978103498 creator A5032101985 @default.
• W1978103498 creator A5041166608 @default.
• W1978103498 creator A5063458279 @default.
• W1978103498 creator A5064014253 @default.
• W1978103498 creator A5083401629 @default.
• W1978103498 creator A5088109393 @default.
• W1978103498 creator A5089653446 @default.
• W1978103498 date "2008-11-01" @default.
• W1978103498 modified "2023-09-23" @default.
• W1978103498 title "Influence of underfill materials on the reliability of coreless flip chip package" @default.
• W1978103498 cites W1964552808 @default.
• W1978103498 cites W1978923643 @default.
• W1978103498 cites W1993672314 @default.
• W1978103498 cites W2039655703 @default.
• W1978103498 cites W2063039654 @default.
• W1978103498 cites W2066364335 @default.
• W1978103498 cites W2070587904 @default.
• W1978103498 cites W2082179116 @default.
• W1978103498 cites W2086130811 @default.
• W1978103498 cites W2095938307 @default.
• W1978103498 cites W2098986515 @default.
• W1978103498 doi "https://doi.org/10.1016/j.microrel.2008.09.005" @default.
• W1978103498 hasPublicationYear "2008" @default.
• W1978103498 type Work @default.
• W1978103498 sameAs 1978103498 @default.
• W1978103498 citedByCount "16" @default.
• W1978103498 countsByYear W19781034982012 @default.
• W1978103498 countsByYear W19781034982013 @default.
• W1978103498 countsByYear W19781034982015 @default.
• W1978103498 countsByYear W19781034982022 @default.
• W1978103498 crossrefType "journal-article" @default.
• W1978103498 hasAuthorship W1978103498A5008021980 @default.
• W1978103498 hasAuthorship W1978103498A5010796482 @default.
• W1978103498 hasAuthorship W1978103498A5032101985 @default.
• W1978103498 hasAuthorship W1978103498A5041166608 @default.
• W1978103498 hasAuthorship W1978103498A5063458279 @default.
• W1978103498 hasAuthorship W1978103498A5064014253 @default.
• W1978103498 hasAuthorship W1978103498A5083401629 @default.
• W1978103498 hasAuthorship W1978103498A5088109393 @default.
• W1978103498 hasAuthorship W1978103498A5089653446 @default.
• W1978103498 hasConcept C111106434 @default.
• W1978103498 hasConcept C111368507 @default.
• W1978103498 hasConcept C121332964 @default.
• W1978103498 hasConcept C125619702 @default.
• W1978103498 hasConcept C127313418 @default.
• W1978103498 hasConcept C127413603 @default.
• W1978103498 hasConcept C151730666 @default.
• W1978103498 hasConcept C153294291 @default.
• W1978103498 hasConcept C159985019 @default.
• W1978103498 hasConcept C163258240 @default.
• W1978103498 hasConcept C171250308 @default.
• W1978103498 hasConcept C176177977 @default.
• W1978103498 hasConcept C177564732 @default.
• W1978103498 hasConcept C18168003 @default.
• W1978103498 hasConcept C192562407 @default.
• W1978103498 hasConcept C204530211 @default.
• W1978103498 hasConcept C24326235 @default.
• W1978103498 hasConcept C2777289219 @default.
• W1978103498 hasConcept C2779227376 @default.
• W1978103498 hasConcept C30239060 @default.
• W1978103498 hasConcept C43214815 @default.
• W1978103498 hasConcept C50296614 @default.
• W1978103498 hasConcept C58097730 @default.
• W1978103498 hasConcept C62520636 @default.
• W1978103498 hasConcept C68928338 @default.
• W1978103498 hasConcept C77928131 @default.
• W1978103498 hasConcept C79072407 @default.
• W1978103498 hasConcept C86803240 @default.
• W1978103498 hasConcept C87976508 @default.
• W1978103498 hasConceptScore W1978103498C111106434 @default.
• W1978103498 hasConceptScore W1978103498C111368507 @default.
• W1978103498 hasConceptScore W1978103498C121332964 @default.
• W1978103498 hasConceptScore W1978103498C125619702 @default.
• W1978103498 hasConceptScore W1978103498C127313418 @default.
• W1978103498 hasConceptScore W1978103498C127413603 @default.
• W1978103498 hasConceptScore W1978103498C151730666 @default.
• W1978103498 hasConceptScore W1978103498C153294291 @default.
• W1978103498 hasConceptScore W1978103498C159985019 @default.
• W1978103498 hasConceptScore W1978103498C163258240 @default.
• W1978103498 hasConceptScore W1978103498C171250308 @default.
• W1978103498 hasConceptScore W1978103498C176177977 @default.
• W1978103498 hasConceptScore W1978103498C177564732 @default.
• W1978103498 hasConceptScore W1978103498C18168003 @default.
• W1978103498 hasConceptScore W1978103498C192562407 @default.
• W1978103498 hasConceptScore W1978103498C204530211 @default.
• W1978103498 hasConceptScore W1978103498C24326235 @default.
• W1978103498 hasConceptScore W1978103498C2777289219 @default.
• W1978103498 hasConceptScore W1978103498C2779227376 @default.
• W1978103498 hasConceptScore W1978103498C30239060 @default.
• W1978103498 hasConceptScore W1978103498C43214815 @default.
• W1978103498 hasConceptScore W1978103498C50296614 @default.
• W1978103498 hasConceptScore W1978103498C58097730 @default.
• W1978103498 hasConceptScore W1978103498C62520636 @default.
• W1978103498 hasConceptScore W1978103498C68928338 @default.

• next