FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W1978182952> ?p ?o ?g. }

• W1978182952 endingPage "H734" @default.
• W1978182952 startingPage "H734" @default.
• W1978182952 abstract "A plasma-enhanced atomic layer deposition (PEALD) copper process, using Cu(II) acetylacetonate and atomic hydrogen, was developed for Cu seed applications in nanoscale semiconductor processing. In this paper, the integration characteristics of PEALD Cu with electroplated Cu for advanced interconnect applications were investigated. Superconformal electroplated [electrochemical deposition (ECD)] copper was demonstrated on PEALD Cu-seeded high aspect ratio patterned structures. The filling characteristics of ECD/PEALD-grown Cu were compared with those of a conventional ECD/physical vapor deposition (PVD)-grown Cu stack. Void-free electroplated Cu was demonstrated on 60 and 35 nm patterned via structures using both atomic layer deposition Ru/TaN and conventional PVD Ta/TaN liner/barrier structures coupled with PEALD Cu seed layers. The resulting integration characteristics suggest that electroplated/PEALD Cu is a promising integration approach for emerging complementary metal oxide semiconductor metallization applications." @default.
• W1978182952 created "2016-06-24" @default.
• W1978182952 creator A5010199088 @default.
• W1978182952 creator A5031272851 @default.
• W1978182952 date "2009-01-01" @default.
• W1978182952 modified "2023-09-27" @default.
• W1978182952 title "Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications" @default.
• W1978182952 cites W1966074049 @default.
• W1978182952 cites W1968124277 @default.
• W1978182952 cites W1991686603 @default.
• W1978182952 cites W1995365717 @default.
• W1978182952 cites W2017411123 @default.
• W1978182952 cites W2017763181 @default.
• W1978182952 cites W2019915545 @default.
• W1978182952 cites W2026624636 @default.
• W1978182952 cites W2027228089 @default.
• W1978182952 cites W2027800729 @default.
• W1978182952 cites W2039765907 @default.
• W1978182952 cites W2053774067 @default.
• W1978182952 cites W2055459990 @default.
• W1978182952 cites W2057769290 @default.
• W1978182952 cites W2066649429 @default.
• W1978182952 cites W2073439750 @default.
• W1978182952 cites W2081853437 @default.
• W1978182952 cites W2083521136 @default.
• W1978182952 cites W2088076964 @default.
• W1978182952 cites W2097519580 @default.
• W1978182952 cites W2107418386 @default.
• W1978182952 cites W2111210304 @default.
• W1978182952 cites W2137108081 @default.
• W1978182952 cites W2140017579 @default.
• W1978182952 cites W2161508873 @default.
• W1978182952 cites W2171299712 @default.
• W1978182952 cites W2332947252 @default.
• W1978182952 cites W3016972814 @default.
• W1978182952 cites W4211184061 @default.
• W1978182952 cites W4239606258 @default.
• W1978182952 cites W4247093114 @default.
• W1978182952 doi "https://doi.org/10.1149/1.3166184" @default.
• W1978182952 hasPublicationYear "2009" @default.
• W1978182952 type Work @default.
• W1978182952 sameAs 1978182952 @default.
• W1978182952 citedByCount "18" @default.
• W1978182952 countsByYear W19781829522012 @default.
• W1978182952 countsByYear W19781829522013 @default.
• W1978182952 countsByYear W19781829522014 @default.
• W1978182952 countsByYear W19781829522017 @default.
• W1978182952 countsByYear W19781829522018 @default.
• W1978182952 countsByYear W19781829522019 @default.
• W1978182952 countsByYear W19781829522021 @default.
• W1978182952 countsByYear W19781829522023 @default.
• W1978182952 crossrefType "journal-article" @default.
• W1978182952 hasAuthorship W1978182952A5010199088 @default.
• W1978182952 hasAuthorship W1978182952A5031272851 @default.
• W1978182952 hasConcept C127413603 @default.
• W1978182952 hasConcept C151730666 @default.
• W1978182952 hasConcept C171250308 @default.
• W1978182952 hasConcept C19067145 @default.
• W1978182952 hasConcept C191897082 @default.
• W1978182952 hasConcept C192562407 @default.
• W1978182952 hasConcept C2779227376 @default.
• W1978182952 hasConcept C2816523 @default.
• W1978182952 hasConcept C29216876 @default.
• W1978182952 hasConcept C42360764 @default.
• W1978182952 hasConcept C51576277 @default.
• W1978182952 hasConcept C51807945 @default.
• W1978182952 hasConcept C544778455 @default.
• W1978182952 hasConcept C64297162 @default.
• W1978182952 hasConcept C69544855 @default.
• W1978182952 hasConcept C86803240 @default.
• W1978182952 hasConceptScore W1978182952C127413603 @default.
• W1978182952 hasConceptScore W1978182952C151730666 @default.
• W1978182952 hasConceptScore W1978182952C171250308 @default.
• W1978182952 hasConceptScore W1978182952C19067145 @default.
• W1978182952 hasConceptScore W1978182952C191897082 @default.
• W1978182952 hasConceptScore W1978182952C192562407 @default.
• W1978182952 hasConceptScore W1978182952C2779227376 @default.
• W1978182952 hasConceptScore W1978182952C2816523 @default.
• W1978182952 hasConceptScore W1978182952C29216876 @default.
• W1978182952 hasConceptScore W1978182952C42360764 @default.
• W1978182952 hasConceptScore W1978182952C51576277 @default.
• W1978182952 hasConceptScore W1978182952C51807945 @default.
• W1978182952 hasConceptScore W1978182952C544778455 @default.
• W1978182952 hasConceptScore W1978182952C64297162 @default.
• W1978182952 hasConceptScore W1978182952C69544855 @default.
• W1978182952 hasConceptScore W1978182952C86803240 @default.
• W1978182952 hasIssue "9" @default.
• W1978182952 hasLocation W19781829521 @default.
• W1978182952 hasOpenAccess W1978182952 @default.
• W1978182952 hasPrimaryLocation W19781829521 @default.
• W1978182952 hasRelatedWork W2038239546 @default.
• W1978182952 hasRelatedWork W2069837720 @default.
• W1978182952 hasRelatedWork W2157231772 @default.
• W1978182952 hasRelatedWork W2157765554 @default.
• W1978182952 hasRelatedWork W2167242356 @default.
• W1978182952 hasRelatedWork W2355234100 @default.
• W1978182952 hasRelatedWork W2379489181 @default.
• W1978182952 hasRelatedWork W2901254677 @default.

• next