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- W1979080655 abstract "Chemo-mechanical polishing (CMP) has been a useful method to produce superior brittle wafer surfaces. This paper reviews the CMP of silicon carbide and sapphire wafers, focusing on efficiency of the polishing rate. The effects of slurry type, slurry pH value and mixed abrasives will be discussed in detail." @default.
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- W1979080655 date "2010-08-01" @default.
- W1979080655 modified "2023-10-18" @default.
- W1979080655 title "A Review on the CMP of SiC and Sapphire Wafers" @default.
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- W1979080655 doi "https://doi.org/10.4028/www.scientific.net/amr.126-128.429" @default.
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