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- W1979726834 abstract "Single-crystal silicon is an excellent infrared window material and is often used as light filter, infrared window and substrate material in an optical system. At the same time single-crystal silicon is typical brittle material. Therefore thermal stress damage has possibly occurred before melting when it is irradiated by laser. In order to investigate on the laser-induced thermal stress damage problem in single-crystal silicon, a spatial axisymmetric finite element model is established to solve the thermal stress problem which a single-crystal silicon substrate is heated by a Nd:YAG laser beam with wavelength of 1064nm and pulse width of the millisecond order. After the temperature and stress fields are obtained, the relevant analysis is carried out. The calculational results are in reasonable agreement with the reported experiment results. It found that the stress value in the central zone of the laser spot exceeds the fracture strength of single-crystal silicon, which can explain the damage of cleavage fracture of the material." @default.
- W1979726834 created "2016-06-24" @default.
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- W1979726834 date "2007-11-29" @default.
- W1979726834 modified "2023-09-25" @default.
- W1979726834 title "Analysis of thermal stress damage in single-crystal silicon induced by 1064nm long pulse laser" @default.
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- W1979726834 doi "https://doi.org/10.1117/12.757773" @default.
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