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- W1979789095 abstract "The deposition of the precise thick‐film buried resistors (with better tolerance) is one of the factors that can increase the integration of the low‐temperature co‐fired ceramic devices further. The thick‐film buried resistors cannot be trimmed after sintering or the trimming is very difficult in the contradiction to the surface resistors. The possibility of utilizing simple stencil printing in the fabrication of thick‐film resistors is presented in this paper. Moreover, the comparison of the variability of the sheet resistances of the screen‐ and stencil‐printed buried resistors was performed using Taguchi Design of the Experiment methodology." @default.
- W1979789095 created "2016-06-24" @default.
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- W1979789095 date "2014-07-03" @default.
- W1979789095 modified "2023-10-16" @default.
- W1979789095 title "The Comparison of Sheet Resistances of Screen‐ and Stencil‐Printed Resistors" @default.
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- W1979789095 doi "https://doi.org/10.1111/ijac.12286" @default.
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