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- W1980278693 abstract "As the feature sizes of microelectronic and optoelectronic components continue to decrease, there has been increased interest in developing new techniques for etching the materials used to construct these highly integrated components. Features of the new techniques now being investigated include etching with neutral species, maskless processing, material selectivity, and reduced electrical damage." @default.
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- W1980278693 date "1990-01-01" @default.
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- W1980278693 title "Excimer Laser‐induced Etching of Semiconductors and Metals" @default.
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