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- W1980340937 abstract "This paper reports the design and initial experimental investigation of a vacuum/airtight package, based on a multilayered LTCC substrate that acts not only as a chip carrier with flexible interconnects but an integrated panel with multiple functional structure. Design, validation and experimental results for various cooling microchannels embedded into the substrate are presented; the substrate temperature rise is cut by over 70% compared with substrate without microchannels. The effect of vacuum on cooling is simulated. A hot-wire micro Pirani gauge are integrated onto the substrate by wire bonding for a simple and effective in-situ vacuum measuring. The packaged sample display a leakage rate of lower than 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>-12</sup> Pa · m <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sup> /s. Therefore, this packaging can be an optimal choice for 3D system-in-package applications demanding high integration density, medium vacuum circumstance and long usage/storage lifecycle." @default.
- W1980340937 created "2016-06-24" @default.
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- W1980340937 date "2010-11-01" @default.
- W1980340937 modified "2023-09-22" @default.
- W1980340937 title "A vacuum/airtight package with multifunctional LTCC substrate and integrated pirani vacuum gauge for 3D SIP integration applications" @default.
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- W1980340937 doi "https://doi.org/10.1109/icsict.2010.5667825" @default.
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