Matches in SemOpenAlex for { <https://semopenalex.org/work/W1980367093> ?p ?o ?g. }
Showing items 1 to 93 of
93
with 100 items per page.
- W1980367093 endingPage "223" @default.
- W1980367093 startingPage "213" @default.
- W1980367093 abstract "The underfill material is a polymeric adhesive used in flip chip packaging. It encapsulates the solder joints by filling the gap between a silicon die and an organic substrate or board. Within a typical flip chip structure, there are interfaces between the various components, namely, substrate, solder mask, flux residue, underfill encapsulant and die passivation layer, etc. Maintaining a good adhesion condition, both as-made and after temperature/humidity aging, is vital for these interfaces because of the expected performance of the flip chip device, where the underfill material is employed to enhance the reliability of the flip chip interconnect. We have studied the adhesion strength between the various components for different process variables as measured with the lap shear and die shear test configurations. The effects of the assembly factors, i.e. solder mask, flux residue, underfill, and die passivation, etc., were evaluated and the adhesion strength was found to depend greatly on these factors. The die shear strength of a passivated die assembled onto an organic board coated with a solder mask was much higher after using a no-clean flux on the solder mask than for the assembly without such a no-clean flux. The influence of some accelerated aging tests on the adhesion durability was also investigated. A die passivation layer of benzocyclobutene exhibited better capability in retaining the die shear strength than a passivation layer of silicon nitride or polyimide, especially for the initial aging period. The knowledge obtained in this study should provide insights into the interfacial adhesion in the flip chip assembly structure." @default.
- W1980367093 created "2016-06-24" @default.
- W1980367093 creator A5009228618 @default.
- W1980367093 creator A5042734294 @default.
- W1980367093 creator A5066578160 @default.
- W1980367093 date "2002-01-01" @default.
- W1980367093 modified "2023-10-18" @default.
- W1980367093 title "Adhesion of underfill and components in flip chip encapsulation" @default.
- W1980367093 cites W16975529 @default.
- W1980367093 cites W1839069591 @default.
- W1980367093 cites W1863500694 @default.
- W1980367093 cites W1925617774 @default.
- W1980367093 cites W1948709913 @default.
- W1980367093 cites W1964103578 @default.
- W1980367093 cites W1994864435 @default.
- W1980367093 cites W2029467307 @default.
- W1980367093 cites W2033370535 @default.
- W1980367093 cites W2057535701 @default.
- W1980367093 cites W2093840598 @default.
- W1980367093 cites W2095843398 @default.
- W1980367093 cites W2103775193 @default.
- W1980367093 cites W2107721681 @default.
- W1980367093 cites W2112611560 @default.
- W1980367093 cites W2113876952 @default.
- W1980367093 cites W2115455177 @default.
- W1980367093 cites W2116288375 @default.
- W1980367093 cites W2121469531 @default.
- W1980367093 cites W2121627191 @default.
- W1980367093 cites W2126985246 @default.
- W1980367093 cites W2133652536 @default.
- W1980367093 cites W2134765994 @default.
- W1980367093 cites W2134986991 @default.
- W1980367093 cites W2141671548 @default.
- W1980367093 cites W2143637956 @default.
- W1980367093 cites W2157382596 @default.
- W1980367093 cites W2163874491 @default.
- W1980367093 cites W2320743631 @default.
- W1980367093 cites W55743848 @default.
- W1980367093 doi "https://doi.org/10.1163/156856102317293713" @default.
- W1980367093 hasPublicationYear "2002" @default.
- W1980367093 type Work @default.
- W1980367093 sameAs 1980367093 @default.
- W1980367093 citedByCount "10" @default.
- W1980367093 countsByYear W19803670932023 @default.
- W1980367093 crossrefType "journal-article" @default.
- W1980367093 hasAuthorship W1980367093A5009228618 @default.
- W1980367093 hasAuthorship W1980367093A5042734294 @default.
- W1980367093 hasAuthorship W1980367093A5066578160 @default.
- W1980367093 hasConcept C111106434 @default.
- W1980367093 hasConcept C159985019 @default.
- W1980367093 hasConcept C171250308 @default.
- W1980367093 hasConcept C192562407 @default.
- W1980367093 hasConcept C2776366733 @default.
- W1980367093 hasConcept C2779227376 @default.
- W1980367093 hasConcept C33574316 @default.
- W1980367093 hasConcept C50296614 @default.
- W1980367093 hasConcept C521977710 @default.
- W1980367093 hasConcept C68928338 @default.
- W1980367093 hasConcept C69567186 @default.
- W1980367093 hasConcept C79072407 @default.
- W1980367093 hasConceptScore W1980367093C111106434 @default.
- W1980367093 hasConceptScore W1980367093C159985019 @default.
- W1980367093 hasConceptScore W1980367093C171250308 @default.
- W1980367093 hasConceptScore W1980367093C192562407 @default.
- W1980367093 hasConceptScore W1980367093C2776366733 @default.
- W1980367093 hasConceptScore W1980367093C2779227376 @default.
- W1980367093 hasConceptScore W1980367093C33574316 @default.
- W1980367093 hasConceptScore W1980367093C50296614 @default.
- W1980367093 hasConceptScore W1980367093C521977710 @default.
- W1980367093 hasConceptScore W1980367093C68928338 @default.
- W1980367093 hasConceptScore W1980367093C69567186 @default.
- W1980367093 hasConceptScore W1980367093C79072407 @default.
- W1980367093 hasIssue "2" @default.
- W1980367093 hasLocation W19803670931 @default.
- W1980367093 hasOpenAccess W1980367093 @default.
- W1980367093 hasPrimaryLocation W19803670931 @default.
- W1980367093 hasRelatedWork W1900362976 @default.
- W1980367093 hasRelatedWork W2002679872 @default.
- W1980367093 hasRelatedWork W2026541147 @default.
- W1980367093 hasRelatedWork W2057168579 @default.
- W1980367093 hasRelatedWork W2101041421 @default.
- W1980367093 hasRelatedWork W2108945888 @default.
- W1980367093 hasRelatedWork W2155179766 @default.
- W1980367093 hasRelatedWork W2397846630 @default.
- W1980367093 hasRelatedWork W4251733017 @default.
- W1980367093 hasRelatedWork W2144410415 @default.
- W1980367093 hasVolume "16" @default.
- W1980367093 isParatext "false" @default.
- W1980367093 isRetracted "false" @default.
- W1980367093 magId "1980367093" @default.
- W1980367093 workType "article" @default.