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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1980567908> ?p ?o ?g. }

• W1980567908 endingPage "04EB04" @default.
• W1980567908 startingPage "04EB04" @default.
• W1980567908 abstract "In this paper, we report the development of reliable fine-pitch micro bump interconnections that used a high-precision room-temperature bonding approach. The accuracy of the bonding process is improved by modifying conventional bump/planar-bonding-pad interconnections to form self-aligned micro bumps/truncated inverted pyramid (TIP) bonding pads, i.e., misalignment self-correction elements (MSCEs). Thermosonic flip-chip bonding (FCB) is utilized to form reliable bonds between these MSCEs at acceptable low temperatures. By applying the proposed bonding approach, the demonstration of fine-pitch Cu bump to Au bonding pad interconnects chip stacking has been realized. Microstructure analyses reveal that 15-µm-pitch micro bump joints are fabricated at room temperature." @default.
• W1980567908 created "2016-06-24" @default.
• W1980567908 creator A5014817787 @default.
• W1980567908 creator A5031378296 @default.
• W1980567908 creator A5038064825 @default.
• W1980567908 creator A5056765632 @default.
• W1980567908 creator A5061495708 @default.
• W1980567908 creator A5064802411 @default.
• W1980567908 date "2014-03-17" @default.
• W1980567908 modified "2023-09-25" @default.
• W1980567908 title "15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications" @default.
• W1980567908 cites W1971719136 @default.
• W1980567908 cites W1971889606 @default.
• W1980567908 cites W1972888176 @default.
• W1980567908 cites W1978248942 @default.
• W1980567908 cites W1983191281 @default.
• W1980567908 cites W1988615677 @default.
• W1980567908 cites W1988939281 @default.
• W1980567908 cites W1997935435 @default.
• W1980567908 cites W2003833052 @default.
• W1980567908 cites W2009827881 @default.
• W1980567908 cites W2020544551 @default.
• W1980567908 cites W2021753116 @default.
• W1980567908 cites W2041071986 @default.
• W1980567908 cites W2044429428 @default.
• W1980567908 cites W2055948640 @default.
• W1980567908 cites W2056768573 @default.
• W1980567908 cites W2081864739 @default.
• W1980567908 cites W2082547627 @default.
• W1980567908 cites W2083533279 @default.
• W1980567908 cites W2089227672 @default.
• W1980567908 cites W2096786446 @default.
• W1980567908 cites W2104291631 @default.
• W1980567908 cites W2107123813 @default.
• W1980567908 cites W2109500250 @default.
• W1980567908 cites W2129807791 @default.
• W1980567908 cites W2130548489 @default.
• W1980567908 cites W2139341438 @default.
• W1980567908 cites W2141987542 @default.
• W1980567908 cites W2152721748 @default.
• W1980567908 cites W2157011764 @default.
• W1980567908 cites W2163451978 @default.
• W1980567908 cites W2315045050 @default.
• W1980567908 cites W4235805287 @default.
• W1980567908 cites W4242730956 @default.
• W1980567908 doi "https://doi.org/10.7567/jjap.53.04eb04" @default.
• W1980567908 hasPublicationYear "2014" @default.
• W1980567908 type Work @default.
• W1980567908 sameAs 1980567908 @default.
• W1980567908 citedByCount "7" @default.
• W1980567908 countsByYear W19805679082014 @default.
• W1980567908 countsByYear W19805679082016 @default.
• W1980567908 countsByYear W19805679082017 @default.
• W1980567908 countsByYear W19805679082019 @default.
• W1980567908 crossrefType "journal-article" @default.
• W1980567908 hasAuthorship W1980567908A5014817787 @default.
• W1980567908 hasAuthorship W1980567908A5031378296 @default.
• W1980567908 hasAuthorship W1980567908A5038064825 @default.
• W1980567908 hasAuthorship W1980567908A5056765632 @default.
• W1980567908 hasAuthorship W1980567908A5061495708 @default.
• W1980567908 hasAuthorship W1980567908A5064802411 @default.
• W1980567908 hasConcept C119599485 @default.
• W1980567908 hasConcept C120665830 @default.
• W1980567908 hasConcept C121332964 @default.
• W1980567908 hasConcept C121684516 @default.
• W1980567908 hasConcept C127413603 @default.
• W1980567908 hasConcept C134786449 @default.
• W1980567908 hasConcept C140269135 @default.
• W1980567908 hasConcept C142575187 @default.
• W1980567908 hasConcept C159985019 @default.
• W1980567908 hasConcept C165005293 @default.
• W1980567908 hasConcept C178790620 @default.
• W1980567908 hasConcept C185592680 @default.
• W1980567908 hasConcept C192562407 @default.
• W1980567908 hasConcept C2779227376 @default.
• W1980567908 hasConcept C33347731 @default.
• W1980567908 hasConcept C41008148 @default.
• W1980567908 hasConcept C49040817 @default.
• W1980567908 hasConcept C530198007 @default.
• W1980567908 hasConcept C59088047 @default.
• W1980567908 hasConcept C68928338 @default.
• W1980567908 hasConcept C79072407 @default.
• W1980567908 hasConcept C87976508 @default.
• W1980567908 hasConceptScore W1980567908C119599485 @default.
• W1980567908 hasConceptScore W1980567908C120665830 @default.
• W1980567908 hasConceptScore W1980567908C121332964 @default.
• W1980567908 hasConceptScore W1980567908C121684516 @default.
• W1980567908 hasConceptScore W1980567908C127413603 @default.
• W1980567908 hasConceptScore W1980567908C134786449 @default.
• W1980567908 hasConceptScore W1980567908C140269135 @default.
• W1980567908 hasConceptScore W1980567908C142575187 @default.
• W1980567908 hasConceptScore W1980567908C159985019 @default.
• W1980567908 hasConceptScore W1980567908C165005293 @default.
• W1980567908 hasConceptScore W1980567908C178790620 @default.
• W1980567908 hasConceptScore W1980567908C185592680 @default.
• W1980567908 hasConceptScore W1980567908C192562407 @default.
• W1980567908 hasConceptScore W1980567908C2779227376 @default.
• W1980567908 hasConceptScore W1980567908C33347731 @default.

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