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- W1980808510 endingPage "085012" @default.
- W1980808510 startingPage "085012" @default.
- W1980808510 abstract "We present a novel method for the fabrication of void-free copper-filled through-glass-vias (TGVs), and their application to the wafer-level radio frequency microelectromechanical systems (RF MEMS) packaging scheme. By using the glass reflow process with a patterned silicon mold, a vertical TGV with smooth sidewall and fine pitch could be achieved. Bottom-up void-free filling of the TGV is successfully demonstrated through the seedless copper electroplating process. In addition, the proposed process allows wafer-level packaging with glass cap encapsulation using the anodic bonding process, since the reflowed glass interposer is only formed in the device area surrounded with silicon substrate. A simple coplanar waveguide (CPW) line was employed as the packaged device to evaluate the electrical characteristics and thermo-mechanical reliability of the proposed packaging structure. The fabricated packaging structure showed a low insertion loss of 0.116 dB and a high return loss of 35.537 dB at 20 GHz, which were measured through the whole electrical path, including the CPW line, TGVs and contact pads. An insertion loss lower than 0.1 dB and a return loss higher than 30 dB could be achieved at frequencies of up to 15 GHz, and the resistance of the single copper via was measured to be 36 mΩ. Furthermore, the thermo-mechanical reliability of the proposed packaging structure was also verified through thermal shock and pressure cooker test." @default.
- W1980808510 created "2016-06-24" @default.
- W1980808510 creator A5056664819 @default.
- W1980808510 creator A5063764815 @default.
- W1980808510 creator A5065126365 @default.
- W1980808510 creator A5087358018 @default.
- W1980808510 date "2013-06-24" @default.
- W1980808510 modified "2023-10-12" @default.
- W1980808510 title "Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging" @default.
- W1980808510 cites W1963484171 @default.
- W1980808510 cites W1971966678 @default.
- W1980808510 cites W1981752752 @default.
- W1980808510 cites W1983016355 @default.
- W1980808510 cites W1987224504 @default.
- W1980808510 cites W1988085157 @default.
- W1980808510 cites W2016411756 @default.
- W1980808510 cites W2017728171 @default.
- W1980808510 cites W2018817588 @default.
- W1980808510 cites W2032808418 @default.
- W1980808510 cites W2036028945 @default.
- W1980808510 cites W2037831697 @default.
- W1980808510 cites W2047020565 @default.
- W1980808510 cites W2054720194 @default.
- W1980808510 cites W2069756028 @default.
- W1980808510 cites W2070173405 @default.
- W1980808510 cites W2087127743 @default.
- W1980808510 cites W2095284351 @default.
- W1980808510 cites W2097178607 @default.
- W1980808510 cites W2140902026 @default.
- W1980808510 cites W2155707315 @default.
- W1980808510 cites W2156084757 @default.
- W1980808510 cites W2163052307 @default.
- W1980808510 doi "https://doi.org/10.1088/0960-1317/23/8/085012" @default.
- W1980808510 hasPublicationYear "2013" @default.
- W1980808510 type Work @default.
- W1980808510 sameAs 1980808510 @default.
- W1980808510 citedByCount "59" @default.
- W1980808510 countsByYear W19808085102014 @default.
- W1980808510 countsByYear W19808085102015 @default.
- W1980808510 countsByYear W19808085102016 @default.
- W1980808510 countsByYear W19808085102017 @default.
- W1980808510 countsByYear W19808085102018 @default.
- W1980808510 countsByYear W19808085102019 @default.
- W1980808510 countsByYear W19808085102020 @default.
- W1980808510 countsByYear W19808085102021 @default.
- W1980808510 countsByYear W19808085102022 @default.
- W1980808510 countsByYear W19808085102023 @default.
- W1980808510 crossrefType "journal-article" @default.
- W1980808510 hasAuthorship W1980808510A5056664819 @default.
- W1980808510 hasAuthorship W1980808510A5063764815 @default.
- W1980808510 hasAuthorship W1980808510A5065126365 @default.
- W1980808510 hasAuthorship W1980808510A5087358018 @default.
- W1980808510 hasConcept C159985019 @default.
- W1980808510 hasConcept C160671074 @default.
- W1980808510 hasConcept C191897082 @default.
- W1980808510 hasConcept C192562407 @default.
- W1980808510 hasConcept C2778638305 @default.
- W1980808510 hasConcept C2779227376 @default.
- W1980808510 hasConcept C2780288131 @default.
- W1980808510 hasConcept C29216876 @default.
- W1980808510 hasConcept C2988571348 @default.
- W1980808510 hasConcept C37977207 @default.
- W1980808510 hasConcept C49040817 @default.
- W1980808510 hasConcept C51807945 @default.
- W1980808510 hasConcept C544778455 @default.
- W1980808510 hasConceptScore W1980808510C159985019 @default.
- W1980808510 hasConceptScore W1980808510C160671074 @default.
- W1980808510 hasConceptScore W1980808510C191897082 @default.
- W1980808510 hasConceptScore W1980808510C192562407 @default.
- W1980808510 hasConceptScore W1980808510C2778638305 @default.
- W1980808510 hasConceptScore W1980808510C2779227376 @default.
- W1980808510 hasConceptScore W1980808510C2780288131 @default.
- W1980808510 hasConceptScore W1980808510C29216876 @default.
- W1980808510 hasConceptScore W1980808510C2988571348 @default.
- W1980808510 hasConceptScore W1980808510C37977207 @default.
- W1980808510 hasConceptScore W1980808510C49040817 @default.
- W1980808510 hasConceptScore W1980808510C51807945 @default.
- W1980808510 hasConceptScore W1980808510C544778455 @default.
- W1980808510 hasIssue "8" @default.
- W1980808510 hasLocation W19808085101 @default.
- W1980808510 hasOpenAccess W1980808510 @default.
- W1980808510 hasPrimaryLocation W19808085101 @default.
- W1980808510 hasRelatedWork W1645394328 @default.
- W1980808510 hasRelatedWork W2012353036 @default.
- W1980808510 hasRelatedWork W2022181719 @default.
- W1980808510 hasRelatedWork W2025180343 @default.
- W1980808510 hasRelatedWork W2026988100 @default.
- W1980808510 hasRelatedWork W2051116798 @default.
- W1980808510 hasRelatedWork W2105153546 @default.
- W1980808510 hasRelatedWork W2133832016 @default.
- W1980808510 hasRelatedWork W2244473467 @default.
- W1980808510 hasRelatedWork W2359213162 @default.
- W1980808510 hasVolume "23" @default.
- W1980808510 isParatext "false" @default.
- W1980808510 isRetracted "false" @default.
- W1980808510 magId "1980808510" @default.
- W1980808510 workType "article" @default.